TSIA Recent Advances and New Trends in 3D IC Packaging, 3D IC Integration, and 3D Si Integration(12hrs)
主辦單位(Organizer):
經濟部工業局、財團法人資訊工業策進會、台灣半導體產業協會
活動日期(Date):
2012-06-22 ~ 2012-06-23
活動地點(Venue):
國立交通大學(新竹市大學路1001號)
報名費用(Registration fee):
會員報名費用: 5000
非會員報名費用: 5000
幣別: 新台幣(NTD)
經濟部工業局已補助50%
聯絡窗口(Contact Window):
江小姐
聯絡方式:
電話: 03-5913181
傳真: 03-5820056
Email: candy@tsia.org.tw
內容說明(Detail):

課程編號:101SD041

課程介紹:
Let students know what are TSV and 3D IC integration (especially interposers) and use these skills for their jobs.

課程大綱:
1.Introduction to Microelectronics and Nanoelectronics
2.Origin and Evolution of 3D Integration
3.Trends and Outlook of 3D Integration
4.Through-Silicon Vias (TSVs): etching, liner, barrier/seed layers, filling, CMP and Cu reveal
5.Challenges and Outlook of 3D Si Integration
6.Challenges and Outlook of 3D IC Integration
7.Thin-Wafer Strength Measurements
8.Thin-Wafer Handling
9.Low-Cost Microbumping
10.C2C and C2W Bonding with Microbumps
11.Low Temperature Bonding
12.Electromigration of Microbump Assemblies
13.Memory Stacking Methods
14.Active TSV Interposers
15.Passive TSV Interposers
16.Thermal Management of 3D IC Integration
17.3D IC and CIS Integration
18.3D IC and MEMS Integration
19.3D IC and LED Integration
20.Embedded 3D Hybrid IC and Opto-electronic Integration in Organic Substrates

課講師介紹:
講  師: 劉漢誠(John Lau)
學經歷: John Lau has been a visiting professor at Hong Kong University Science & Technology. Prior to that, he was the Director of Microsystems, Modules & Components (MMC) Laboratory with Institute of Microelectronics (IME, Singapore) for 2 years and a Senior Scientist/MTS at HP/Agilent in US for more than 25 years. With more than 35 years of R&D and manufacturing experience, he has authored or co-authored more than 350 peer-reviewed technical publications and more than 100 book chapters, and given more than 270 presentations worldwide. He has authored and co-authored 16 textbooks on reliability of 3D IC interconnects, 3D MEMS packaging, advanced packaging, reliability of 3D IC interconnects, solder joint reliability, and lead-free soldering and manufacturing.
專  長: 3D IC integration
 
課程時間:
2012/6/22~6/23,
6/22(週五)晚間18:00-22:00,
6/23(週六)日間8:30-17:30,共計12小時

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